What the types are of encapsulates?
All chips are encapsulated in different shapes and sizes, depending on the function they are going to fulfill. In addition, each type of encapsulation has a distribution, and assignment of pins which you can consult in the respective data sheets. At present, there is a wide variety of encapsulates. To know them better, you must take the VLSI course online. Here, we will give you the basic concepts.
DIP (Dual In line Package) encapsulates – these are the oldest type of encapsulation. They are covered by a rectangular plastic housing with a row of pins on each side. The maximum number of pins of these packages is usually 48. These packages can be welded into the holes made in the plates, or they can also be inserted into arranged sockets.
Encapsulated SIP (Single In line Package) – like DIP, they are the oldest encapsulated and have a single row of pins for connection, the maximum number of these is usually 24. Also, like the DIP, these packages can be welded in holes made in the plates. And are used for integrated circuits of small and medium scale integration.
Encapsulated SOIC (Small Outline Integrate Circuit) – these packages are the equivalents of the DIPs, but superficially mounted since their pins are arranged in the form of seagull wings. So they are called gullwing packages. They were the first to introduce a very small distance between their pins and, obtain a greater number, generally more than 64.
Encapsulated QFP (Quad Flat Package) – terminals of this type of encapsulation are the same type as SOIC, but are characterized by pins on all four sides of the component. These are also of a superficial assembly, like those mentioned above.
SOJ (Small Outlined J-Lead) Encapsulates – These packages have pins only on two sides of the device. The letter J of the name is because the terminals have the form of that letter. They are widely used in SMD technologies and also when assembling the DRAM chips that were manufactured with DIP packages.
BGA (Ball Grid Array) encapsulates – these types of encapsulations appear in the face of the need to increase the number of inputs, and outputs of integrated circuits without the need to increase the size of the device in large quantities or that too thin pins appear. They have pins which are shaped like tin or lead balls, located on the bottom surface of the component. With this distribution of pins, terminals and distances between them are avoided.
Modern edge technology for us
The effort of the electronics industry in the miniaturization of its equipment has been largely compensated with the discovery of integrated circuits, in which thousands of components have been built within the same capsule, whose dimensions are similar to those of a simple -transistor. The huge reduction in volume has not been the only advantage for which integrated circuits have become indispensable in many cutting-edge industries, but beneficial for every aspects of modern technology. If you want to design VLSI integrated circuits, join the VLSI design course online.